SK Hynix is the second largest semiconductor manufacturer in the world. In Q3 this year, the Company has received an operation profit of 3,700 billion KRW, 415% higher than last year. This growth is mainly due to price hike of chips.
Spetember 7th, Foxconn speakersman Louis Woo told the Press that the Company’s offer to acquire Toshiba Chips has been receiving support from Apple, SoftBank and Sharp. Although the details of the offer remains unknown, according to informed sources, Foxconn and its partners are to offer USD18.4 billion for the deal, higher than the price offered by the group formed by Western Digital, Bain Capital and SK Hynix.
Terry Guo, Chairman of Hon Hai Precision Industry told the Press that Hon Hai offers USD27 billion for Toshiba semicon storage business. Apple, Dell and Kingston have joined Hon Hai’s team in the competition against Broadcom, Western Digital and SK Hynix.
Mar 28th, Tsinghua Unigroup has received RMB100 billion investment from China Development Bank and RMB10 billion from Sino IC Capital for developing chip business.
Tsinghua Unigroup is investing USD30 billion to build a semi-conductor production base in Nanjing to manufacture 3D-NAND FLASH and DRAM. Upon completion, this factory will be the biggest chip maker in China with a capacity of 100,000 chips per month.
TSMC is upgrading its 16nm process, likely to 12nm. Presently the best process on the market is 10nm by Samsung in making Snapdragon for Qualcomm. TSMC will also provide 10nm process for iPhone this year. 12nm will be TSMC’s answer to over-order on 10nm and counter measure to 14nm from competitors.
TSMC is to adopt 7nm FinFET manufacturing process in chip making since Q2 2017, to prepare for A series processor to be used in iPhone and iPad.
Dec 22, UniGroup Guoxin (SZ: 002409) and its related companies are to found a Long Rive Holdings to hold the equity of Long Rive Storage Tech Ltd. UniGroup will provide RMB19.7 billion for 51.04% of the shares.